Not entirely fitting perhaps, but I found this article fascinating and thought I’d share it. These 2 chaps have set about attempting to deconstruct the CPU inside the 3DS. The blog article takes you from the process of physically removing the CPU from the board all the way to using sulfuric acid to remove the packaging materials to expose the layers of silicon underneath. There are some accompanying shots of the highly magnified layers underneath, for your viewing pleasure.
Who knows if this will ever lead to anything for the 3DS homebrew hopers, but it’s probably a step in the right direction and makes for a very interesting read to boot.